It’s important to note, this potential interconnect was never included in Apple’s official renders of the M1 Max die. Connecting multiple M1 Max chips together in this manner would result in ...

Srouji moved on to explain how the company has managed to combine two M1 Max chips into one M1 Ultra. He pointed out a die-to-die interconnect tech that was always on the M1 Max, something Apple ...

During its launch event today, Apple revealed that the M1 Max chips housed a secret feature: a die-to-die interconnect, dubbed "UltraFusion," that allows it to connect multiple chips.

The M1 Ultra chip interconnects the die of two M1 Max chips for higher performance and support for up to 128GB of unified memory, compared to a limit of 64GB for the M1 Max chip.

Now Apple's M1 Ultra chip isn't a game-changer in the sense of changing games, at all, really. You can run games on an Apple machine, of course, but that's not what this GPU is in any way built to ...

For the new M1 Ultra, it does so by effectively combining two M1 Max chips. Apple uses a die-to-die interconnect called UltraFusion to connect the two dies together.

A Mac Pro-bound, four-M1 Max configuration, for example, would offer a whopping 40 CPU cores and 128 GPU cores, theoretically for quadruple the performance.Apple would need to recruit an I/O die ...

UltraFusion removes that burden by using a silicon interloper to connect the die of two M1 Max chips across more than 10,000 signals, delivering 2.5TB/s of low-latency, interprocessor bandwidth ...

M1 vs M1 Pro vs M1 Max - Construction. Apple's system-on-chips (SoC) are produced by long-time foundry partner TSMC, the same source of Apple's A-series chips.

Like the A14 Bionic, the ‌M1‌ chip is built using TSMC's first-generation 5nm fabrication process. On the other hand, the ‌M2‌ uses TSMC's second-generation 5nm process like the A15 Bionic ...