The collaboration will facilitate the development of a total solution that includes Logic+DRAM interface design, TSV formation, wafer thinning, testing and chip stacking assembly for customers. The ...

Yet enabling 3D-IC/TSV integration for emerging memory and logic applications is impossible without the ability to achieve tight wafer-to-wafer alignment,” stated Paul Lindner , executive technology ...

Power is a critical issue. “You want the signals to go through (from logic to memory) at a femtoJoule rate,” Geer said. For power-conscious mobile systems, TSVs are the only realistic way to connect a ...

One common test need for TSV-based 3D ICs is for lowering the cost of probing fine-pitch microbumps.” One way to tackle this problem is to incorporate more self-testing features on the chip.

The value of TSV-enabled products is expected to increase significantly based on their enhanced performance that will in turn offset the increased cost of manufacturing. The EMC-3D Consortium of ...

At the European 3D TSV Summit in Grenoble, France, on January 22-23, 2013, imec announced that together with Cadence Design Systems they have developed, implemented, and validated an automated 3-D ...

"Samsung's new 3D integration technology ensures reliable TSV interconnections even at the cutting-edge EUV process nodes," said Moonsoo Kang, senior vice president of Foundry Market Strategy at ...

Elpida, Powertech and UMC are collaborating on TSV (through silicon via) technology to produce 3D packages for combining memory and logic ICs made on 28nm processes. The collaboration leverages Elpida ...

Semiconductor design is starting to see the adoption of 3D IC packages. These packages involve stacking multiple bare die vertically using connections that go directly though the silicon.

"We are committed to bringing more 3D IC innovation that can push the boundaries of semiconductors." In its own X-Cube test chips, Samsung engineers built a logic die with SRAM stacked on top.

Wide I/O 2: supporting 3D-IC packaging for PC and server applications Wide I/O increases the bandwidth between memory and its driver IC logic by increasing the IO data bus between the two circuits.

The collaboration will facilitate the development of a total solution that includes Logic+DRAM interface design, TSV formation, wafer thinning, testing and chip stacking assembly for customers. The ...