Yet enabling 3D-IC/TSV integration for emerging memory and logic applications is impossible without the ability to achieve tight wafer-to-wafer alignment,” stated Paul Lindner , executive technology ...

The collaboration will facilitate the development of a total solution that includes Logic+DRAM interface design, TSV formation, wafer thinning, testing and chip stacking assembly for customers. The ...

Widespread use of 3D-ICs would result in increased performance, smaller footprints, and reduced cost and power consumption. However, multiple manufacturing challenges must first be solved because ...

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One common test need for TSV-based 3D ICs is for lowering the cost of probing fine-pitch microbumps.” One way to tackle this problem is to incorporate more self-testing features on the chip.

The drive to reduce power and increase performance demands advanced packaging technologies such as SiP and 3D-IC/TSV. Apache recognized that these technologies pose major power, thermal, and stress ...

2. TSV-based 3-D parts Scaling is becoming expensive, causing chip makers to look at TSV-based devices. ''Many groups have reported through-silicon-via based 3D IC (TSV-3D IC) where a single ...

"We are committed to bringing more 3D IC innovation that can push the boundaries of semiconductors." In its own X-Cube test chips, Samsung engineers built a logic die with SRAM stacked on top.

Delivering his presentation January 23 at the European 3D TSV Summit, Quinn said SoCs are fabricated in established processes with test standards and proven test equipment. Moving on to sensors ...

"Samsung's new 3D integration technology ensures reliable TSV interconnections even at the cutting-edge EUV process nodes," said Moonsoo Kang, senior vice president of Foundry Market Strategy at ...

S'pore forms group to boost 3D chips New consortium seeks to advance Singapore's 300mm wafer manufacturing capabilities by focusing on through-silicon via for 3D integrated circuit packages.

The collaboration will facilitate the development of a total solution that includes Logic+DRAM interface design, TSV formation, wafer thinning, testing and chip stacking assembly for customers. The ...