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Zacks Investment Research on MSNCadence Advances SoC and Chiplet Design With Samsung FoundryCadence Design Systems, Inc. CDNS has announced a significant expansion of its partnership with Samsung Foundry through a new ...
Collaboration expanded with a new multi-year IP agreement and joint development of advanced AI-driven flows on the latest ...
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Intel claims its optical interconnect chiplet technology is 'like going from using horse-drawn carriages to using cars and trucks'The chiplet was packaged with an Intel CPU and shown ... Of course, the initial applications will be used for AI infrastructure and HPC environments, where scalability concerns across racks ...
Alphawave Semi announces successful tape out of UCIe IP subsystem on TSMC's 2-nm process, supporting 36G die-to-die data ...
SEMIFIVE's HPC chiplet platform will offer notable advantages over traditional chiplet platforms to reduce cost, optimize performance, and enable development flexibility. This platform will advance ...
Designed to meet the high-bandwidth demands of emerging AI infrastructure, the chiplet is well-suited for data centers and HPC applications. This first OCI implementation supports 64 PCIe 5.0 channels ...
09, 2024 (GLOBE NEWSWIRE) -- Movellus and Tenstorrent announced that Tenstorrent has licensed Movellus’ digital IP family as part of a strategic engagement, for its AI and HPC chiplet solutions.
To Shalf, that constitutes the next step in the chiplet and HPC crossover: “Instead of repurposing hardware designed for a different market, chiplets could be tailor-made for the science space.
The HPC architecture primarily consists of chiplets and HBM. Heterogenous integration technology is used to integrate HBM on the chiplet, with copper microbumps providing the “required vertical ...
SEMIFIVE's HPC chiplet platform will offer notable advantages over traditional chiplet platforms to reduce cost, optimize performance, and enable development flexibility. This platform will ...
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