Why have wafer shipments remained flat while AI semiconductor demand is booming and fab investments are rising?

New DRAM standard aims to solve a critical bottleneck.

HBM production will be prioritized due to its profitability and increasing demand. However, limited yields of around 50–60% and a wafer area 60% larger than DRAM products mean a higher ...

The latest-gen DRAM process is essentially technology for stacking DRAM chips, with Samsung applying its new D1c to next-gen HBM -- HBM4 in this case -- Samsung is expected to be in a far better ...

South Korean memory chip giant SK Hynix will produce sixth-generation high-bandwidth memory (HBM4) chips using TSMC’s 3nm process for key clients in the second half of 2025, The Korea Economic Daily ...