C&G Hi Tech announced it has succeeded in large-area (510*515mm) thin-film formation with a thickness of over 7N/cm and a ...
Taiwan-based makers have established an alliance targeting the supply of glass substrates, potentially a game changer for semiconductor packaging. Printed circuit board (PCB) and IC substrate ...
FR4 is FR4, right? For a lot of PCB designs, the answer is yes — the particular characteristics of the substrate material don ...
Somewhat surprisingly, NASA’s own PCB working group guidelines list many common substrate materials, like glass fiber and phenolic resins. It does list a number of more exotic materials ...
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Advanced Micro Devices, Inc. (AMD) Secures Patent for Glass Core Substrates, Enhancing AI and 5G Chip TechnologiesA close up of a complex looking PCB board with several intergrated ... has been granted a new patent covering the use of glass core substrates, possibly for advanced multi-chiplet processors.
Taiwan-based makers have established an alliance targeting the supply of glass substrates, potentially a game changer for semiconductor packaging. Printed circuit board (PCB) and IC substrate ...
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