Disco is the market leader in slicing and dicing machines used in the preparation of semiconductors, with around 70% market share. It has a solid track record of sustained growth, high ...

Disco's business model is to bundle its three core technologies of dicing, grinding, and polishing, and provides systematic solutions which include equipment, consumable tools, and after-sales ...

KARIYA, Japan, March 19, 2012 /PRNewswire/ -- IMRA America, Inc., a subsidiary of Aisin Seiki Co., Ltd., and DISCO Corporation have agreed to collaborate in the development of new lasers and ...

DUBLIN--(BUSINESS WIRE)--The "Global Wafer Mounter Equipment Market 2017-2021" report has been added to Research and Markets' offering. The global wafer mounter equipment market to grow at a CAGR ...

“Disco has grown at twice the semiconductor industry’s pace because of this need for precision grinding and dicing equipment,” Damian Thong, an analyst at Macquarie Group Ltd., said.

Disco is an 87-year-old company with approximately 7,000 employees, and manufactures approximately three-quarters of the machines used in cutting, polishing and dicing semiconductors around the world.