This innovation shatters foreign technological monopolies, reducing wafer costs by 40 per cent while increasing the device breakdown voltage to 2000V. According to an official statement ...

But it also contaminates the grind wheel, so subsequent wafers get copper spread on it.” Several critical decisions go into the thinning and processing of thin device wafers. Which temporary bonding ...

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future ...

The cost of SiC substrates needs to come down. But are we going to hamper these efforts by imposing limits on the thickness ...

During the production process, the 4-, 6- and 8- inch (100, 150 and 200 mm) diameter wafers undergo a PECVD process ...

The light activates a photoresist on the surface, which allows the etching of a pattern on the wafer. Through successive iterations of photolithography and the deposition of metals, devices with ...

Semiconductor devices often face the severe challenge of high temperature environment during operation, and excessively high ...

Advances in TMD growth Building on our success in scaling ultra-wide bandgap materials, we have made significant progress in expanding scalable growth of two-dimensional (2D) materials, specifically ...