Macworld One way or another, it seems that prices for future Apple devices are going up. If it’s not because of tariffs, a ...

Breakthrough approach delivers better scaling and power efficiency, but at the cost of new processes like wafer thinning, bonding, and advanced debug.

But it also contaminates the grind wheel, so subsequent wafers get copper spread on it.” Several critical decisions go into the thinning and processing of thin device wafers. Which temporary bonding ...

TSMC’s revenue growth helped boost its profitability. The company ended the first quarter with net income of NT$361.56 ...

Polar Semiconductor ("Polar"), the only U.S.-owned merchant foundry specializing in sensor, power, and high-voltage ...

A world-first N-polar GaN wafer created by Chinese scientists could be a game changer for the semiconductor industry.

ePAK provides leading solutions for the handling, transport and processing of advanced semiconductor and optical devices. Wafer carriers, processing boats, canisters, and flex frames along with JEDEC ...

The GEMINI equipment platform includes a newly designed high-force bond chamber that ensures bond quality and yield for MEMS devices built on larger wafers. EVG has already delivered several GEMINI ...

and high-performance GaN device wafers. Surya Iyer, President and COO of Polar Semiconductor said, "This licensing and commercial production agreement underscores our commitment to strengthening ...

Polar Signs Agreement with Renesas to License GaN-on-Si Technology and Onshore Commercial Fabrication of Advanced Devices on 200mm Wafers The Partnership Strengthens the Domestic Supply Chain and ...