Employing the company's radial folded fin design, the copper core Radial Fin heatsinks are designed for application with SECC2 and PGA microprocessors found in PCs, workstations and servers. These ...

Figure 4: radial folded fin unit under test. ... Factoring in the added cost and weight of copper, aluminum was chosen as the fin material. The fin thickness was modeled using 0.3 to 0.7-mm thick ...

TAIPEI, Taiwan, March 28, 2021 (GLOBE NEWSWIRE) -- ATP Electronics, the global leader in specialized storage and memory solutions, announced the launch of its new NVMe flash storage solutions with ...

The UltraCool IV series of pin fin heatsinks is forged from highly conductive oxygen-free copper. This metal exhibits a thermal conductivity that's 20% better than pure aluminum and 40% greater ...