Driver-IC backend firm Chipbond Technology is set to land COF packaging orders from Apple for a LCD-based iPhone device to be launched in 2019, allowing it to continue enjoying brisk sales in the ...

ChipMOS to boost monthly COF capacity to 62 million units due to strong LCD driver IC demand Amy Lee, Taipei; Esther Lam, DigiTimes.com Chip on glass (COG) capacity will remain at the present 20 ...