Today, many companies are developing multi-die systems. Some, like AMD, Intel, and Nvidia, manage the entire development ...

Primemas Inc., a fabless semiconductor company specializing in chiplet-based SoC solutions through its Hublet® architecture, ...

Cadence Rolls Out System Chiplet to Reorganize the SoC Dec. 18, 2024 Learn more about the motivations behind Cadence’s new Arm-based system chiplet in the latest installment of The Briefing.

Understanding the technology and supporting ecosystem is necessary before chiplets begin to see widespread adoption.

Arm Zena CSS, combined with Cadence’s automotive chiplet and IP solutions, are essential for accelerating chiplet-based SoC design. Cadence chiplet and IP solutions are built in accordance with the ...

Cadence Design Systems, Inc. CDNS has announced a significant expansion of its partnership with Samsung Foundry through a new ...

Renesas is leveraging Arteris multi-die technology in its R-Car Gen 5 SoC platform for advanced driver-assistance systems ...

Figure 1 The system chiplet comprises components such as a system processor, safety management processor, controllers, and PHY IPs for LPDDR5 and UCIe. Source: Cadence. The system chiplet—complying ...

Cadence (Nasdaq: CDNS) today announced an expansion of its collaboration with Samsung Foundry, including a new multi-year IP ...

Arm Zena CSS, combined with Cadence’s automotive chiplet and IP solutions, are essential for accelerating chiplet-based SoC design. Cadence chiplet and IP solutions are built in accordance with the ...

Intel used Auto Shanghai 2025 to debut its second-generation AI-enhanced system-on-chip (SoC) for software-defined vehicles (SDVs). This new SoC is the first in the automotive sector to use a ...

BOS Semiconductors, the Korean automotive fabless company, and Tenstorrent, an AI design company, are pleased to announce the first debut of industry's first automotive AI accelerator chiplet SoC ...