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For example, Eliyan recently announced operational test chips for its UCIe-compatible NuLink PHY technology, which can transfer 40Gbps per chiplet interface bump, which allows die-to-die ...

chiplet technology, has claimed the availability of a 5-nm silicon device that operates at 40 Gbps/bump and delivers over 2.2 Tbps/mm of beachfront bandwidth at a 130-um pitch on standard organic ...

UCIe-3D promises way higher bandwidth density and better power efficiency versus 2D or 2.5D chiplet layouts. It uses advanced hybrid bonding with insanely tight bump pitches down to 1 micron or below.

And with the finer pitches of the bumps, and single routes ... work—so important as the interconnect is to the entire RDNA 3 chiplet architecture, you know, working at all.

Learn more about the motivations behind Cadence’s new Arm-based system chiplet in the latest installment of The Briefing. The semiconductor industry is moving out of the monolithic age of the ...

Taiwan Semiconductor Manufacturing Company (TSMC) is reportedly working with Nvidia to develop next-generation GPUs utilizing advanced chiplet technology. This collaboration is expected to play an ...

AMD debuted this new “chiplet” technology in the AMD “Zen 2”-based 2nd Gen EPYC server processor (formerly codenamed “Rome”), which will go down in history as the first processor to ...

The patent describes a multi-chiplet GPU with three separate dies, which is something that could both improve performance and cut back on production costs. In the patent, AMD refers to a GPU that ...

The Taichi-II chiplet, which could one day power super-intelligent AI models, ups the ante in light-based processing. When you purchase through links on our site, we may earn an affiliate commission.

SAN DIEGO, July 24, 2024--(BUSINESS WIRE)--Chiplet Summit announces its third annual event on January 21-23 at the Santa Clara Convention Center. The 2025 meeting focuses on a new level in chip ...