Managing chiplet resources is emerging as a significant and multi ... because that’s where the whole thing started — from the physical availability of a smaller bump pitch. It’s the same thing today.

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

CAMBRIDGE, Mass.--(BUSINESS WIRE)--HyperLight, the industry leader in thin-film lithium niobate (TFLN) technology, today announced the launch of its TFLN Chiplet™ platform, a modular and ...

Looking at the latest shipping docs, it appears that AMD’s new Medusa Point APU might feature a chiplet-based design. Early information shows a 12-core Zen 6 module built on TSMC’s 3 nm ...

Febraury 5, 2024 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect ... achieving bandwidth of 64Gbps/bump on ...

JEDEC and OCP (Open Compute Project Foundation) announce new Chiplet Design Kits for EDA use covering four areas: Assembly, Substrate, Material and Test. Basically, they are a way for chiplet builders ...

At the Hannover Messe the FMD unveiled its new Chiplet Application Hub. Designed to serve as a central platform for the development and application of chiplet technologies, the hub aims to bridge ...