AMD's next-gen "Strix Halo" Zen 5-based APU has been pictured on Chiphell, showing off its chiplet-based deisgn, using 256-bit LPDDR5X memory. The new Strix Halo APU will feature a chiplet-based ...

AMD’s MI400 APU lands in 2026, boosting AI ... the MI400 will build on Team Red’s chiplet-based modular architecture and is expected to increase compute density, power efficiency, and scalability.

Alongside it, we got a taster of the RDNA 3, which Su has confirmed will utilise a Ryzen-like chiplet design. Back in June, AMD's product technology architect, Sam Neffziger, implied that the ...

The beefier Strix Point Halo APU will reportedly feature a Zen 5 chiplet design -- versus the Zen 5 monolithic on the Strix Point APU -- with up to 16 cores (only up to 12 cores in the hybrid ...

The slides purportedly show the AMD Strix Halo APU, also occasionally referred to as Sarlak, composed of a pair of eight-core Zen 5 CCDs or Core Chiplet Dies plus a monster SoC tile containing ...

Looking at the latest shipping docs, it appears that AMD’s new Medusa Point APU might feature a chiplet-based design. Early information shows a 12-core Zen 6 module built on TSMC’s 3 nm ...

The APU is said to max out at 16 cores and 32 threads, as well as 16MB of L2 cache, 32MB of L3 cache per core chiplet die (CCD), and an additional 32MB of MALL cache, which seems to be something ...

The boffins behind the AMD Instinct MI300A APU have published their research ... The third EHP revision required stacking HBM modules on every GPU chiplet, delaying the implementation.

A new leak has revealed an upcoming mobile APU from AMD - codenamed ‘Sound ... presumably with a ‘chiplet’ design that separates the CPU’s components into multiple smaller chips on the ...

Ltd. announces the release of a market assessment report on the "Global Chiplet Market- (By Processor ... Unit (CPU), Application Processing Unit (APU), Artificial Intelligence Application ...

Faraday has unveiled an advanced packaging service that simplifies chiplet integration by coordinating various vendors and chiplet sources. The platform offers three core services—design, packaging, ...