With 288MB of L3 cache reportedly available in the top-end Nova Lake CPU, Intel looks as though it's taking AMD 3D V-cache head on.

Intel teases Foveros 3D packaging technology: Meteor Lake-P CPUs in 2023 laptops teased with 6P+8E CPU diagram showed off at Hot Chips 34 conference.

That makes it 5C/5T. Foveros means that these CPU cores can be vertically stacked with the memory on top. Check out the diagram below for a cross section view of a Lakefield chip.

Secondly, we'll have the 6-core Ryzen 5 5500X3D processor with base CPU clocks of 3.0GHz and boost clocks of up to 4.0GHz, which leaves CPU clock speeds down 300MHz to 400MHz under the Ryzen 5 ...

AMD Ryzen 4000H Renoir Block Diagram Confirms GPU PCIe 3 Limitation For Gaming Laptops by Paul Lilly — Thursday, July 23, 2020, 11:03 AM EDT Comments ...

Yesterday at Computex 2021, AMD CEO Lisa Su showed off the company's next big performance play—3D stacked chiplets, allowing the company to triple the amount of L3 cache on its flagship Zen 3 CPUs.