Hybrid bonding involves die-to-wafer or wafer-to-wafer connection of copper pads that carry power and signals and the surrounding dielectric, delivering up to 1,000X more connections than copper ...

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future ...

Semiconductor research lab Imec has demonstrated wafer-bonding with 400nm pitch copper conductors across the boundary, proposing the technology for logic-on-logic and memory-on-logic wafer stacking ...

EVG is participating with the following professional development course, papers and posters in the ECTC technical program ...

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...

From left to right: Gerald Silberer, Regional Sales Director Europe (EV Group); Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID); Dr. Manuela Junghähnel ...

Typically these carrier wafers are made of glass. The carrier wafer is bonded to the wafer to make sure it can go through production without being damaged. Once it's finished production ...