Several critical decisions go into the thinning and processing of thin device wafers. Which temporary bonding adhesive is most compatible with the process flow? Can it fix the thin wafer in place ...

Hybrid Bonding Technology Market is Segmented by Type (Wafer-to-wafer Hybrid Bonding, Die-to-wafer Hybrid Bonding), by Application (CMOS Image Sensor (CIS), NAND, DRAM, High Bandwidth Memory (HBM)).

Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems ...

The SB6/8e system features a rigid vacuum chamber for best-in-class post-bond alignment accuracy, independent upper and lower substrate heaters and precise programmable force control during the wafer ...

Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the new GEMINI equipment platform includes a newly designed high-force bond chamber that ensures excellent ...

The surge in demand for gold wire bonding, semiconductor wafer bonding, and 3D semiconductor assembly-based solution has led to the growth of the automotive and consumer electronics segments ...