This simulator takes a little thinking and lets you build devices as you might on an IC die. The key is to use the drop-down that initially says “Interact” to select a tool. Then, the drop ...

Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out on a package substrate to a floorplan geometry suitable for connecting to a printed ...

Traditional IC packaging substrate design is typically very similar to a small-scale laminate ... and all engineers will learn is that such situations are bad and should be avoided. These issues are ...

The eGaN monolithic half-bridge IC, which has the highest power density solution evaluated in this chapter, exhibits comparable thermal performance to the best Si MOSFET based design, which is ...

It is expected that ENGIN-IC’s design capabilities will strengthen MACOM’s ability to serve its target markets and gain market share. Founded in 2014 by industry veterans, ENGIN-IC has focused ...

On top of that, with enhancements in chip manufacturing, testing and packaging technology, and market status, Taiwan's IC design sector has the world's best manufacturing infrastructure to build a ...

Petaling jaya: Creating its own semiconductor ecosystem is crucial for Malaysia to move up the value chain and be able to source local semiconductor chips to data centres, says Economy Minister ...

Taiwan is set to host the Best AI Awards 2025, an international competition designed to drive innovation in Artificial Intelligence (AI) and Integrated Circuit (IC) Design. Advised by the Ministry ...