Creating real 3D designs is proving to be much more complex and difficult than 2.5D, requiring significant innovation in both technology and tools. While there has been much discussion about 3D ...

On the power side of 2.5D designs there are some extra issues that have to be considered during the design process, pointed out Steve Smith, senior director of 3D IC strategy and marketing at Synopsys ...

While 2.5D multi-die integration is mature and already widely used by GUC, emerging 3D multi-die integration allows the next level of connection density, power efficiency, and very low latency.

It enables IC designers to efficiently author, simulate and manage heterogeneously integrated 2.5D/3D IC designs with a fast, predictable path for planning and heterogeneous integration, ...

This is the fourth part of the series on chip packaging technologies. In this episode, Dr. Navid Asadi’s group looks at 2.5D and 3D chip construction.

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...

Narrator: This is 2D hand-drawn animation. [horns toot] And this is 3D computer-generated animation. But many films actually fall somewhere in between -- or what's often referred to as "2.5D." ...