A new technical paper titled “Cool-3D: An End-to-End Thermal-Aware Framework for Early-Phase Design Space Exploration of Microfluidic-Cooled 3DICs” was published by researchers at University of ...

Zuken has announced that it has signed an agreement with IBM to join the IBM Research AI Hardware Center as a commercial ...

In the physical design flow of 3D ICs, the placement stage includes a differentiated design step to assign instances to different tiers, i.e., top or bottom, called tier partitioning. Despite its ...

"Co-design and co-analysis of silicon and advanced packages with Synopsys' 3DIC Compiler platform is another example of how our close collaboration results in advanced productivity solutions that ...

Oct. 20, 2020 -- Synopsys, Inc. (Nasdaq: SNPS) today announced it has received four 2020 OIP Partner of the Year awards for IP and EDA solutions from TSMC demonstrating excellence in next-generation ...