Power-supply designers are more frequently being tasked to deliver higher power in the same footprint they had in their last design. 3D packaging will help make this goal a reality.

Over the past decades, energy engineers have been developing a wide range of new technologies that could power electronic ...

Design in a 2.5D and 3D world is causing a convergence of many issues and all of them impact the power delivery network. Power has to be analyzed in terms of the power itself and, in addition, signal ...

Figure 8: Example of an embedded assembly. The ability to execute an embedded power design is very dependent on the availability of inserted passive components, optimized for PCB embedding purposes.

Book: Using predictive analytics and heterogeneous package workflows to design cost-effective multi-die assemblies.

In East Tennessee, a 3D printer arm has been used to build concrete shielding columns for a nuclear reactor. The work is part ...

Intel is calling its Tri-Gate 3D Transistor the most significant development since the transistor was invented over 50 years ago. But regardless of whether the claim will hold true, the CPU design ...

There may still be some camera makers resisting the 3D trend, but that's getting to be an increasingly dwindling lot -- the latest to jump into the game is Rollei, the 90-year old German ...

New and emerging technologies for 3D packaging are being deployed at the printed-circuit-board (PCB) level. Power-density goals can be simplified with component integration into chip-scale ...