Western Digital and Toshiba have jointly announced that they have begun initial production on 64-layer 3D NAND in 512Gb capacities. This new pilot production at the company's fab in Yokkaichi ...

Western Digital said on Tuesday that it has completed development of its next-generation 3D NAND technology, which packs 64 layers of vertical storage capacity. Called BiCS3, the tech is now in ...

Toshiba and its strategic partner Western Digital are nearly done with the latest iteration: 128-layer 3d NAND. A year ago we were at 48 and 64 layers NAND. This year 96-layers is the development ...

Western Digital today announced that it has successfully developed four bit-per-cell (also known as X4) 3D NAND built using 64-layer, BiCS3 technology. The company says that these chips can store ...

The latest chips follow on the heels of the 128-layer device from Micron, which also employed 3D NAND and 64-layer stacks. The challenge that RG NAND addresses is the capacitance between cells (Fig.

In 2013, Samsung shipped the world’s first 3D NAND, a 24-layer 128Gbit device. Today, suppliers are shipping 64- and 96-layer 3D NAND devices and are now racing each other to ramp up products at the ...

Demand for 3D NAND began to recover in the latter half of ... To bolster domestic production, the Japanese government has assigned up to $1.64 billion in subsidies for Kioxia and its partner ...

Based on NEO’s existing 3D X-DRAM technology, the new cells are advertised as being able to hold 512 Gb (64 GB) on a single ... can be constructed like 3D NAND: in a stacked design allowing ...

Mass production of 64-layer 3D NAND drives is expected to follow during the second-quarter of 2017. 'The launch of the industry's first 512Gb 64-layer 3D NAND chip is another important News ...

Built on Micron’s new industry-leading 64-layer 3D NAND technology, the Micron 5200 series of SSDs offers a cost-optimized SATA platform for business-critical virtualized workloads that cripple ...

Like the TEM, the FIB/SEM approach is slow and destructive. In an example of this approach, a 64-layer 3D NAND sample is delayered or milled layer by layer using a gas-enhanced FIB. Then, ...

Western Digital and Toshiba have jointly announced that they have begun initial production on 64-layer 3D NAND in 512Gb capacities. This new pilot production at the company's fab in Yokkaichi ...