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Broadcom unveils gigantic 3.5D XDSiP platform for AI XPUs — 6000mm² of stacked silicon with 12 HBM modulesBroadcom has introduced its 3.5D eXtreme Dimension System in Package (3.5D XDSiP) platform for ultra-high-performance processors for AI and HPC workloads. The new platform relies on TSMC's CoWoS ...
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