HSINCHU, Taiwan-- (BUSINESS WIRE)--Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the launch of its 2.5D/3D advanced package service.

GUC Leverages 3DIC Compiler to Enable 2.5D/3D Multi-Die Package WeiHsun is a guest author and Deputy Manager, Core Methodology Department, at Global Unichip Corp. In the rapidly evolving world of ASIC ...

The 2.5D Advanced Package I-Cube S technology included in the turnkey solutions, is a heterogeneous integration package technology, with multiple chips in one package to enhance inter-connection ...

Those are the typical application spaces for 2.5D.” Andreas Nagy, Xcerra’s senior director of marketing, argues that it always begins with form factor, but adds that testing isn’t that much different ...

And all of that IP is being used for 2.5D packages and fan-outs. “Security is a big issue, particularly secure addresses and memory,” said Frankwell Lin, Andes president. “New applications should pay ...

These diagrams show an integrated package using a redistribution layer. Source: Fujitsu Through silicon via (TSV) TSV—a key enabling technology in 2.5D and 3D packaging solutions—provides a vertical ...

The Cadence 16G UCIe™ 2.5D advanced package IP supports Cadence’s Intelligent System Design™ strategy, which enables SoC design excellence.

A 2.5D package uses a silicon interposer, which is placed between the substrate and the dice, where this silicon interposer has Through-Silicon Vias (TSVs) connecting the metallization layers on ...

"As part of every customer engagement, Rambus provides reference designs for the 2.5D package and interposer to ensure first-time right implementations for mission-critical AI/ML designs." ...