HSINCHU, Taiwan-- (BUSINESS WIRE)--Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the launch of its 2.5D/3D advanced package service.

Interposers are used to connect one active die to another in a 2.5D package configuration, enabling very dense interconnection with more effective heat dissipation, improved processing speed and ...

GUC Leverages 3DIC Compiler to Enable 2.5D/3D Multi-Die Package WeiHsun is a guest author and Deputy Manager, Core Methodology Department, at Global Unichip Corp. In the rapidly evolving world of ASIC ...

The 2.5D Advanced Package I-Cube S technology included in the turnkey solutions, is a heterogeneous integration package technology, with multiple chips in one package to enhance inter-connection ...

And all of that IP is being used for 2.5D packages and fan-outs. “Security is a big issue, particularly secure addresses and memory,” said Frankwell Lin, Andes president. “New applications should pay ...

Figure 1. State-of-the-art 2.5D package design versus 3D functional interposer design (IMAGE) Tokyo Institute of Technology ...

That’s not their focus. “Their concern is whether they can do a flip chip, and then wire bond on top of it — basically a package-on-package on the 2.5D,” said Praturu. “Their criteria also includes ...

These diagrams show an integrated package using a redistribution layer. Source: Fujitsu Through silicon via (TSV) TSV—a key enabling technology in 2.5D and 3D packaging solutions—provides a vertical ...

Chip, package, board and system designers manage numerous multiphysics challenges that increase the risk of failure for advanced 2.5D packaging designs. Issues such as power integrity, signal ...

The Cadence 16G UCIe™ 2.5D advanced package IP supports Cadence’s Intelligent System Design™ strategy, which enables SoC design excellence.

A 2.5D package uses a silicon interposer, which is placed between the substrate and the dice, where this silicon interposer has Through-Silicon Vias (TSVs) connecting the metallization layers on ...