Bill Acito (all posts) Bill Acito is an IC packaging services consultant with Siemens EDA, helping customers navigate the complex packaging design flows for advanced packaging, 2.5D, 3D, and chiplets.

There’s going to be a lot of design rules they have to adhere to in a 2.5D flow. That will limit the danger of doing something wrong compared to the past, but they’re still going to need to look at ...

The GLOBALFOUNDRIES 2.5D technology addresses the challenges of multi-die integration with solutions for front-end steps such as via-middle TSV creation, and flexibility for the backend steps ...

Broadcom is trying to build even bigger AI chips with its 3.5D packaging technology that was introduced last month. By stacking accelerator chips with 3D integration before placing them next to ...

This is what 2.5D advanced packaging (CoWoS) looks like, with ASE showing off an incredible model in Taiwan of how the components are bound together.

GLink 2.0 and GLink 2.3LL specifications GUC (3443.TW) provides full AXI, CXS or CHI bus bridges with configurable parameters (bus width and other properties) using a GLink 2.3LL physical interface.

Publisher Coatsink and developer Sad Cat Studios have announced 2.5D science-fiction retro-futuristic action platformer REPLACED for Xbox Series, Xbox One, and PC (Steam, Epic Games Store). It will… ...

Seoul-based developer Newcore Games has announced The Devil Within: Satgat, a 2.5D action platformer for PlayStation 5, Xbox Series, PlayStation 4, Xbox One, Switch, and PC (Steam). It will launch … ...