Bill Acito (all posts) Bill Acito is an IC packaging services consultant with Siemens EDA, helping customers navigate the complex packaging design flows for advanced packaging, 2.5D, 3D, and chiplets.

The GLOBALFOUNDRIES 2.5D technology addresses the challenges of multi-die integration with solutions for front-end steps such as via-middle TSV creation, and flexibility for the backend steps ...

“IC design organizations are seeing dramatic spikes in IC test complexity due to the rapid adoption and deployment of designs featuring densely packed dies in 2.5D and 3D devices,” said Ankur Gupta, ...

At Cadence, Bansal noted that the company has been building up its 2.5D/3D flow most notably with STMicroelectronics; in addition to its inclusion in foundry reference flows. Mentor, as well, has ...

The choice between 2.5D and 3D design approaches depends largely on the specific application requirements, including size, performance, and integration complexity. The 3DIC Compiler from Synopsys ...

Broadcom is trying to build even bigger AI chips with its 3.5D packaging technology that was introduced last month. By stacking accelerator chips with 3D integration before placing them next to ...